DayOne Data Centers in early talks for a potential $500 million bond

DayOne Data Centers is in early discussions with banks about a potential $500 million bond offering. The company is already juggling an IPO filing, a giant loan package and a fresh Series C round, so this would be another line on its funding list. The details on the debt Citigroup is the lead arranger on the potential bond, and the issuance could be finalized as early as 2027. The proceeds would support DayOne’s expansion efforts. The bond conversations sit alongside a much larger debt effort. DayOne has closed half of an approximately $7 billion-equivalent loan package, described as one of Asia’s largest AI-linked borrowings. On October 5, 2026, DayOne filed for a US IPO aiming to raise as much as $5 billion by listing American depositary shares on Nasdaq under the ticker DODC. That listing follows a $4.5 billion Series C funding round the company closed in June 2026. Growth is fast, and so are the losses In the first half of 2026, the company reported revenue of $512 million, up from $151.5 million in the same period a year earlier. DayOne’s net loss widened to $77.2 million, compared with a $12.6 million loss a year before. DayOne has secured 2.3 GW of customer bookings across i...