GlobalFoundries shares climb as much as 7% on $2 billion TSMC interposer deal

GlobalFoundries has landed a supporting role in the AI chip boom, and investors liked the casting. The chipmaker announced a five-year, $2 billion manufacturing agreement with TSMC on October 8, 2026. Its shares rose as much as 7% shortly after the news. The product at the center of the deal is not a headline-grabbing processor. It is the silicon interposer, a part few people outside the industry think about, but one that increasingly shapes how quickly AI hardware can reach customers. What GlobalFoundries will build for TSMC Under the agreement, GlobalFoundries will manufacture silicon interposers for TSMC’s CoWoS advanced packaging ecosystem. These interposers will include embedded deep trench capacitors, meaning the capacitors are built into the interposer itself. Today’s AI accelerators are multi-die designs, and the speed of communication between processors and memory is central to how well they perform. Production will take place at GlobalFoundries’ fab in Malta, New York, where the company plans to expand capacity. Once up and running, Malta is set to become the first US-based source of silicon interposers for TSMC’s CoWoS technology. Volume production is expected to start r...