GlobalFoundries signs five-year silicon interposer deal with TSMC

GlobalFoundries has signed a five-year silicon interposer manufacturing agreement with TSMC. Volume production under the deal is expected to ramp in the first half of 2028. What the two chipmakers agreed to The partnership centers on silicon interposers. Think of an interposer as a high-speed wiring board made of silicon that lets several chips sit side by side and talk to each other as if they were one. Technically, interposers carry dense routing and vertical connections that link processors, memory, and other dies inside a single package. That approach is usually called 2.5D or 3D heterogeneous integration. For GlobalFoundries, the deal builds on its 65PKG silicon interposer platform, which is already production-qualified. The process is rated TRL9, the top of the technology readiness scale, meaning it is past the lab stage and ready for real manufacturing. The 65PKG platform includes through-silicon vias measuring 10µm x 100µm, along with multi-layer copper routing. Those vias are tiny vertical tunnels that carry signals and power straight through the silicon, rather than around it. The work runs out of GlobalFoundries’ facility in Malta, New York. The platform is designed to s...