Intel strengthens position in packaging tech as TSMC scrambles to respond

Intel’s EMIB (Embedded Multi-die Interconnect Bridge) technology is emerging as a genuine competitive advantage in advanced chip packaging, a segment that’s becoming critical as AI workloads push the limits of what single chips can do. Google, Amazon, and the rest of the lineup Google is adopting Intel’s EMIB-T packaging for its 9th-generation TPU, codenamed “Humufish.” Google’s tensor processing units are the backbone of its AI infrastructure, and choosing Intel over TSMC’s CoWoS for packaging signals genuine technical confidence. Google isn’t alone. Amazon, Cisco, SpaceX, and Tesla have all been confirmed as external customers for Intel’s packaging solutions. MediaTek announced its support for both TSMC CoWoS and Intel EMIB on May 29, 2026. Intel’s EMIB and Foveros technologies are projected to generate billions in annual revenue. Why packaging matters more than you think Intel’s EMIB technology excels at 2.5D integration, connecting chiplets side by side on a single package with high-bandwidth bridges between them. Foveros adds 3D stacking capabilities, letting chips sit on top of each other. TSMC’s CoWoS technology has been the industry standard for advanced packaging, particul...