Micron unveils 512GB memory module, volume production set for 2027

Micron Technology just crammed the equivalent of four memory sticks into one. The company announced the world’s first 512GB DDR5 RDIMM on September 15, a server memory module that achieves its capacity through vertical stacking of DRAM dies connected by through-silicon vias, a fancy way of saying the chips are built upward rather than outward. No extra physical space required on the server board. Volume production is slated for the second half of 2027, timed to coincide with next-generation server platforms from AMD and Intel. Both chipmakers are reportedly validating Micron’s design. What the numbers actually mean The new module supports a maximum transfer rate of 9,200 MT/s. In a fully loaded dual-socket server configuration with 24 slots, that translates to up to 12TB of DDR5 memory. Each 512GB module draws just 16W of power. The four 128GB modules it replaces collectively consume 44.2W, making the new RDIMM more than 60% more power-efficient for the same total capacity. Micron also claims performance improvements beyond raw capacity. The company presented evidence showing up to a 1.4x efficiency increase for certain Spark SVM analytics workloads compared to existing 256GB DDR5 ...