Nvidia and Amkor plan over 300% jump in advanced packaging capacity

Nvidia has a demand problem, the kind most companies would happily trade places with. Its answer is a plan to grow key parts of its semiconductor supply chain by more than 300% to keep pace with AI demand. The headline piece involves Amkor Technology. Announced at GTC Berlin on October 21, 2026, Amkor plans to boost its advanced packaging interposer wafer capacity in South Korea by over 300% by the end of 2028. What Nvidia and Amkor are building An interposer is the platform that sits underneath those components and connects them. If you cannot make enough interposers, it does not matter how many processors roll off the line, because they have nowhere to sit. Amkor’s South Korea expansion is meant to ease exactly that bottleneck. The company plans to put approximately 3 trillion won, or around $2.2 billion, into its Gwangju facility to strengthen packaging for AI and high-performance computing (HPC). Ground was broken in Gwangju on October 19, 2026, just two days before the Berlin announcement. The project is expected to create around 2,000 jobs in the region. The packaging push does not stop at Amkor. Nvidia will also expand substrate capacity by 2.5x by working with multiple supp...