SK Hynix breaks ground on $4B advanced packaging facility in Indiana

SK Hynix held a groundbreaking ceremony on August 27 for its first US advanced packaging facility, located at Purdue University’s Research Park in West Lafayette, Indiana. The investment exceeds $4 billion. The facility spans 133.5 acres. And the ambition behind it is simple: make high-bandwidth memory (HBM) chips on American soil to feed the AI industry’s insatiable appetite for faster, denser memory. What SK Hynix is actually building This isn’t a traditional chip fabrication plant. It’s an advanced packaging facility, which means silicon wafers will still be manufactured at SK Hynix’s fabs in South Korea, then shipped to Indiana for the intricate process of stacking and packaging them into finished HBM products. The end result qualifies as “Made in USA,” which matters quite a bit given the current geopolitical climate around semiconductor supply chains. SK Hynix is targeting October 2028 for cleanroom operations to begin. Mass production of HBM4E, the company’s next-generation high-bandwidth memory product, is expected to start in the second half of 2029. HBM is the memory technology that sits inside the AI accelerators powering data centers for companies like Nvidia, Microsoft,...